Influence of cardboard structure on the quality of packaging adhesion

  1. Home
  2. Archive
  3. № 1 (89)
Author(s) Collection number Pages Download abstract Download full text
Бойчук Я. А., Havenko S. F., Kadyliak M. S., Kulik L. Y. № 1 (89) 46-57 Image Image

The modern packaging industry is adapting to the challenges of sustainable development through the use of environmentally friendly materials that meet the requirements of convenience and functionality, minimizing the negative impact on the environment. This applies to cardboard packaging, which is manufactured using gluing technologies on modern folding and gluing lines. The paper presents key factors that influence the bonding mechanism of cardboard packaging, including glue properties (viscosity, setting speed, adhesion and cohesion; cardboard characteristics and properties (porosity, surface smoothness, density and thickness); environmental con­ditions (temperature and humidity; preparation and adjustment of equipment (folding accuracy, pressing force, amount and place of glue application). Types of adhesions are described, which explain the formation of strong bonding in the manufacture of cardboard packaging. Based on electron microscopic studies of the surface of cardboards and glue, their significant influence on the mechanism of adhesive bonding was confirmed. The dynamics of wetting of cardboards by glues from the moment of contact with the surface was studied. It was found that cardboards have different resistance to wetting, which should be taken into account when choosing the glue and the method of its application to the substrate to ensure optimal bonding strength. The influence of the transverse and longitudinal directions of the cardboard on the delamination force of glued webs is shown. It has been shown that the mechanism of gluing cardboard packaging is a dynamic interaction between physical processes (bending, pressing, cooling/evaporation) and chemical reactions (glue polymerization), which ensures the functionality and strength of the finished packaging.

Keywords: cardboard, packaging, adhesives, microscopy, structure, bonding, wetting dynamics, adhesion, strength, quality

doi: 10.32403/0554-4866-2025-1-89-46-57


  • 1. Teletov, O. S., Shatova, V. M. (2014). Packing as an object of innovative marketing. Management and Marketing of Innovations, (2014), 11–20.
  • 2. Grand View Research. (2023). Green packaging market size, share & trends analysis report by packaging type (recycled, reusable, degradable), by application (food & beverages, healthcare), by region, and segment forecasts, 2023–2030. https://www.grandviewresearch.com/industry-analysis/green-packagingmarket
  • 3. Hortseva, L. V., Kostiuchenko, T. P., Stadnichuk, N. O., Mikhlik, I. V., & Kronikovskyi, O. I. (2020). Osoblyvosti bezpechnoho vykorystannia i toksykolohichna otsinka suchasnoho kharchovoho pakuvannia ta vymohy do noho. Naukovі pratsі Natsіonalʹnoho universytetu kharchovykh tekhnolohii, 26(2), 50–56.
  • 4. Zakowska, H. (2017). Opakowania a środowisko: monografia. Warszawa: Wydawnictwo Naukowe PWN SA.
  • 5. Havva, O. M., & Bespalko, A. P. (2008). Pakuvalne obladnannia. Kyiv.
  • 6. Innovatsiini kleiovi tekhnolohii: Revoliutsiini materialy dlia maibutnoho [Electronic resour­ce]. (n.d.). https://www.kolloris.org.ua.
  • 7. Fabuljak, F. H. (1994). Skleiuvannia polimernymy kleiamy. Teoriia adhezii. Visnyk Akademii inzhenernykh nauk, (2), 75–79.
  • 8. Havenko, S. F. (1997). Problemy skleiuvannia z vykorystanniam olihomerno-polimernykh kleiovykh kompozytsii. Naukovi zapysky Rivnenskoho pedinstytutu. Fizyka kondensovanykh vysokomolekuliarnykh spoluk, 3, 43.
  • 9. Repeta, V. (2013). Influence of surface energy of polymer films on spreading and adhesion of UV-Flexo inks. Acta Graphica, (3), 79–84.
  • 10. Kshyvetskyi, B. Ya., Datskiv, H. M., & Andrashek, Y. V. (2019). Zahalni vidomosti pro klei, skleiuvannia ta termichno modyfikovanu derevynu. Naukovyi Visnyk NLTU Ukrainy, 29(3), 81–84.
  • 11. Ulchenko, S. O., & Makarenko, A. O. (2008). Vplyv heometrychnykh parametriv kleiovoho shva na yakist skleiuvannia kartonnykh pakuvanʹ. Tekhnolohichni protsesy, 2(20), 26–33.
  • 12. Holovatska, N. V. (2010). Doslidzhennia ekspluatatsiinykh vlastyvostei krokhmalʹnykh kleiv. Doslidzhennia krokhmalʹnykh kleiv dlia vyhotovlennia hofrokartonu. Kvalilohiia knyhy, 1(17), 87–90.
  • 13. Leks-Stępień, J. (2015). Metody pomiaru szybkości penetracji cieczy w podłoże papierowe. Przegląd Papierniczy, 71(12), 674.
  • 14. Kulik, L. Y. (2016). Doslidzhennia mekhanichnykh vlastyvostei kartoniv. Kvalilohiia knyhy, 1(29), 85–89.
  • 15. Bernatsek, V. V., & Khadzhynova, S. Ye. (2009). Doslidzhennia sorbtsiinykh vlastyvostei paperu. Kvalilohiia knyhy, 1(15), 32–35.
  • 16. Boychuk, Ya., & Khadzhynova, S. (2025). System analysis of comprehensive quality control of cardboard packaging. In 1st International Scientific and Practical Conference “NextGen Print & Packaging” (Lviv, May 21–23, 2025): Conference proceedings [Electronic edition]. Lviv: Lviv Polytechnic Publishing House.